3D printer nozzles, which is sort of the opposite (industrial heating products).

Part of the argument is that better heat conduction means that you can run the nozzle cooler resulting in less heat conduction to the cold side (above where you want the filament to melt) so I guess its "cooling" in a sense too.

> ugly synthetic diamonds

Not any more, their quality has increased recently. Not that I care, wife and I did without them during our engagement.

I’m surprised nobody has done a phone screen yet

> I have long joked that I want a diamond frying pan

As long as you don’t use it on a gas stove, you should be fine.

What you linked is bonding a diamond substrate to the back of your IC. What's in the post is growing diamond lattice/features directly on your wafer. With the new way, you can get diamond closer to your heat sources, increase contact area, etc.

No idea if it actually matters. Is this a single digit percentage increase in thermal conductivity by messing with a finicky, temperamental process? I don't know. What the paper writers are proposing is under the limit of when transistor structures break down, but not by much.

I think what they have grown diamond on the transistor which then bonds to the substrate through a SIC interlayer.

From what I understand their idea seems to be that since most heating occurs at channels they act like hotspots and therefore it would be much better to drain away heat from them directly.

This is different from creating transistors on a diamond substrate.

The invention is a fast, low-temperature deposition process, which can then be used directly on a semiconductor device.

The new thing here is growing a thin layer of diamond directly on top of a chip.